STAR CLASS SPEAKER under prior consideration :

MAKE THE MOST OF OPPORTUNITIES
Ding Wenwu
Director of Electronics and Information Products Management Department, MIIT
F. C. Tseng,
Vice Chairman
TSMC
Jiang Shoulei
Secretary General
Shanghai Integrated Circuit Industry Association
Jean-Marc Chery, Senior Executive Vice President & CTO
STMicroelectronics
Yoichi Yano
Executive Vice President, Renesas Electronics Corp.
20120514_195704.jpg Shiuh-Wee Lee
Vice President, Technology Development
SMIC
Keenan Evans
Senior Vice President
ON Semiconductor
20120514_200544.jpg Jeffrey Lam
Vice President, GLOBALFOUNDRIES Singapore
20120514_194216.jpg Ulf SchneiderPresident
Singapore Semiconductor Industry Association
20120514_201635.jpg Shi Lei
Executive Director & Chairman
Shanghai Integrated Circuit Industry Association

BRAND NEW FEATURES FOR 2012:

  • Better researched program, higher profiled speakers and participants, more dedicated organizer
  • Acquire a thorough understanding of government policy direction toward “Twelfth Five-year plan”, Tax Policy and Investment Wishing List
  • Networking with leading executives in the Asia semiconductor community.
  • Pay attention to the future development trend of Asia SoC design
  • Examining 3D technology application in IC design and packaging
  • Bridging the gap between fabless and foundry.
  • Realizing profitability through industry chain optimization.
  • Meet with a distinguished collection of government officials, representatives of the world's leading IC design, foundry and test and IDM’s specialists, practitioners and participants from the global semiconductor fraternity

AGENDA

Summit Networking
June 20th, 2012 Session 1: Commercial Session One-on-One Meeting(VIP Room)
June 21st, 2012 Session 2: Technology Session

INDUSTRY VOICE:

“The world semiconductor industry is undergoing a major restructuring in response to the rapidly changing dynamics of global competition.”
—Semiconductor Industry Association

“The world market for semiconductor products will continue to shift towards Asia in future.”
—TSMC

“During the 12th FYP period from 2011-2015, China's semiconductor industry policy will shift away from the pursuit of capacity and output value growth toward a focus on improving R&D capabilities and firms' global competitiveness.”
—China’s 12th Five-Year Plan
Letter of Support

TESTIMONIALS:

“Semiconductor Asia 2012 pulled together a great agenda here - very salient topics.”
— Shanghai Integrated Circuit Industry Association

“This Summit presents a very interesting view of important topics and it should lead to a very useful and important conference.”
— MediaTek, Inc.

“Great coverage of the expanding Asia and international market and good selection of topic.”
—Micro Technology, Inc.

“The Summit provides a brilliant platform to understand the core of semiconductor development and share valuable experience.”
— SMIC